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  1. Application Notes
  2. XMODEL in the Literature

Jaeha Kim, “A UVM Reactive Testbench for Jitter Tolerance Measurement of High-Speed Wireline Receivers”, Design and Verification Conference and Exhibition (DVCon) US, 2023.

« Daniel Stanley, et al., “Fast Validation of Mixed-Signal SoCs”, IEEE Open Journal of the Solid-State Circuits Society, 2021.
Seungah Park, et al., “System-Level Simulation of a SPAD-Based Time-of-Flight Sensor in SystemVerilog”, Design and Verification Conference and Exhibition (DVCon) Europe, 2023. »

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